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d a t a sh eet objective speci?cation file under integrated circuits, ic02 1997 mar 03 integrated circuits PCB8517 stand-alone osd for monitor applications
1997 mar 03 2 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 features interface with microcontroller 3-wire high speed (maximum 2.5 mbits/s) serial interface with three types of transmission sequence. on-screen display (osd) on-chip pll oscillator to generate the osd dot clock frequency which is 384 horizontal sync frequency horizontal sync frequency range of 10 to 100 khz 10 rows of 24 characters display buffer 128 character fonts 12 16 character matrix programmable height of displayed character (from 16 to 63 scan-lines); frame basis 4 types of character size; single/double character height/width; row basis horizontal starting position: 32 different positions (6 dots for each step) vertical starting position: 64 different positions (4 scan-lines for each step) 8 foreground character colours: selection of only 2 out of the 8 (outside the window) and 4 out of the of 8 (in the window) in the same row 3 character shadowing modes: C no shadow C shadowing C bordering shadow 3 fully programmable background windows with overlapping capability and presetting priorities (for multi-level application). the window colour can be selected from 1 out of 8 half tone in background window supported single 5 v power supply available in dip16 package. general description the PCB8517 is a stand-alone osd which is used to display the adjustment/status information on the screen of an auto-sync monitor for menu driving application. the display operation of the device is controlled by a microcontroller which programs the internal 273 bytes of ram via a 3-wire high-speed serial interface. the on-chip pll oscillator and programmable character height are used to keep the same character size displayed on the screen in different display modes, vga, svga and xga for example. the osd of the PCB8517 provides display buffers of 10 rows with 24 characters each. these display buffers can select from 128 customized character fonts (with 12 16 bit resolution) to be displayed. the characters displayed on the screen can be specified double height, double width, different colour and with/without shadowing. three positional background windows are provided for multi-level application. ordering information type number package name description version PCB8517p dip16 plastic dual in-line package; 16 leads (300 mil) sot38-4
1997 mar 03 3 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 block diagram fig.1 block diagram. handbook, full pagewidth high speed serial i/o interface display buffer 24 10 ram display control pll oscillator colour encoder character fonts 128 font rom control registers 12-stage shift register osden red green blue fb htone mgd762 window and frame control 3 4 15 14 13 12 10 6 7 8 5 3 2 vco bias hflb vflb sck sdi en 4 v dda v ssa v ddd v ssd 1 916 vclk 11 + -
1997 mar 03 4 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 pinning symbol pin description v ssa 1 analog ground vco 2 dc control voltage input/output to regulate the internal pll oscillator frequency; a low-pass ?lter circuit is connected to this pin bias 3 bias input/output to regulate the bias current of internal current control oscillator to resonate at a speci?c dot frequency v dda 4 analog power supply hflb 5 horizontal sync input signal from ?yback circuit with negative polarity en 6 active low input to enable serial interface sdi 7 data input of serial interface sck 8 clock input of serial interface v ddd 9 digital power supply vflb 10 vertical sync input signal from ?yback circuit with negative polarity htone 11 half tone control which outputs a logic 1 during windowing except characters are displayed; it is used to lower the external red, green and blue ampli?er gain to achieve a transparent windowing effect fb 12 fast blanking output of osd; active high and high impedance when osd is disabled blue 13 blue colour output of osd; active high and high impedance when osd is disabled green 14 green colour output of osd; active high and high impedance when osd is disabled red 15 red colour output of osd; active high and high impedance when osd is disabled v ssd 16 digital ground fig.2 pin configuration. handbook, halfpage PCB8517 mgd760 1 2 3 4 5 6 7 8 v ssa vco bias v dda hflb en sdi sck v ssd red green blue fb htone vflb v ddd 16 15 14 13 12 11 10 9
1997 mar 03 5 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 functional description 3-wire high speed serial interface (hssi) the 3-wire ( en, sdi and sck) high speed serial interface of the PCB8517 is write only and is used to write data from the microcontroller to the internal 273 bytes of ram (see section internal ram organization (see fig.4)) to control the osd. the ram is organized into 11 rows of 32 columns (see fig.4) and can be programmed by three types of sequence (see section data sequence and format). d ata protocol figure 3 shows the protocol of hssi. to initiate hssi transmission, pin en must be low to enable the PCB8517 to accept data. the en input must be pulled low prior to the occurrence of sck and remain low until after the last sck clock pulse. the rising edge of sck facilitates the input data of sdi being shifted into an 8-bit shift register. when the shift register is full this data will be loaded into a row address register, column address register or into one of the internal ram bytes. table 1 shows the switching characteristics when the hflb pin has a pulse presented, but when there is no horizontal sync pulse present on the hflb pin, the transmission bit rate will be slowed down to 500 kbit/s. table 1 switching characteristics (under operating conditions) symbol parameter min. max. unit t su(en) en to sck set-up time 200 - ns t h(en) en to sck hold time 100 - ns t sckl sck low time 200 - ns t sckh sck high time 200 - ns t su(sdi) sdi data set-up time 200 - ns t h(sdi) sdi data hold time 100 - ns fig.3 3-wire serial interface protocol. handbook, full pagewidth b7 msb first byte lsb b0 b7 b7 b0 b7 b0 last byte t su(en) t h(en) t sckl t sckh t h(sdi) t su(sdi) en sck sdi mgd764
1997 mar 03 6 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 d ata sequence and format the PCB8517 provides the following 3 types of transmission sequence: sequence a: r t ca t d t r t ca t d etc. sequence b: r t ca t d t ca t d t ca t d etc. sequence c: r t cb t d t d t d t d etc. where: r = row address, ca = column address a, cb = column address b, d = data of ram. the column address will be increased by 1 automatically after each bit of data has been stored into the ram. in sequence c, if the column address of the last data is 1fh, the row address will also be increased by 1. the sequence a is particularly suitable for updating small amounts of data between different rows. however, if the current information byte has the same row address as the previous one, sequence b is recommended. for a greater information update, such as a power-up situation, sequence c should be used. bit b7 in table 2 is used to distinguish between row or column address and bit b6 is used to distinguish between column address a or b. when a or b sequence is transmitted, the column address should be formatted as column address a, and the data format of column address b is used for sequence c. there are some limitations on using mixed formats during a single transmission, for example when pin en has been pulled to low once. allowed: from a to b or c from b to a. not allowed: from c to a or b. table 2 data format note 1. x = dont care. internal ram organization (see fig.4) the internal ram is addressed with rows 0 to 10 and columns 0 to 31. the osd character display buffers are located in columns 0 to 23 of rows 0 to 9. each display buffer contains a character rom address and the colour control bit corresponding to a display location on the monitor screen. each row data is associated with two control registers which are located at columns 30 and 31 of their respective row. also three window control registers for three windows together with three frame control register occupy the first 13 columns of row 10. address data byte (1) b7 b6 b5 b4 b3 b2 b1 b0 row address 1 x x x r3 r2 r1 r0 column address a 0 0 x c4 c3 c2 c1 c0 column address b 0 1 x c4 c3 c2 c1 c0
1997 mar 03 7 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 d isplay buffers table 3 display buffers; see table 4 table 4 explanation of table 3 data byte bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 ccs0 ca6 ca5 ca4 ca3 ca2 ca1 ca0 bit name description 7 ccs0 this bit de?nes the characters colour. when the character has no window background with it, colour 0 is selected if ccs0 = 0, otherwise colour 1 is selected. when the character is inside a window and the ccs1 bit of the corresponding windows control register is 0, the colour selection is the same as no window background, and if ccs1 = 1, colour 2 is selected when ccs0 = 0, otherwise colour 3 is selected. 6 to 0 ca6 to ca0 these 7 bits de?ne 1 of 128 character symbols to be displayed in this position. fig.4 internal ram map. handbook, full pagewidth window 1 control row character display buffers reserved column row control 0 9 10 0 2356891213 31 mgd763 23 0 24 29 30 31 window 2 control window 3 control frame control reserved
1997 mar 03 8 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 r ow control registers table 5 column 30 table 6 explanation of table 5 note 1. when the display row is selected to be double width, only even column characters will be displayed on the screen and the odd column characters will not appear. table 7 column 31 table 8 explanation of table 7 w indow control registers there are three control registers for each window. window 1 occupies columns 0 to 2 of row 10, columns 3 to 5 of row 10 are occupied by window 2 and columns 6 to 8 of row 10 are occupied by window 3. if window overlapping occurs, the highest priority window will cover the lowest. window 1 has the highest priority and window 3 the lowest. table 9 columns 0, 3 and 6 of row 10 data byte bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 r0 g0 b0 r1 g1 b1 chs cws bit name description 7 to 5 r0, g0, b0 colour definition of colour 0 4 to 2 r1, g1, b1 colour definition of colour 1 1 chs this bit defines the height of the display character; when chs = 1 double height is selected. 0 cws this bit defines the width of the display character; when cws = 1 double width (1) is selected. data byte bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 r2 g2 b2 r3 g3 b3 reserved bit name description 7 to 5 r2, g2, b2 colour definition of colour 2 4 to 2 r3, g3, b3 colour definition of colour 3 data byte bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 msb row start address lsb msb row end address lsb
1997 mar 03 9 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 table 10 explanation of table 9 table 11 columns 1, 4 and 7 of row 10 table 12 explanation of table 11 table 13 columns 2, 5 and 8 of row 10 table 14 explanation of table 13 f rame control registers table 15 column 9 of row 10 bit name description 7to4 - these bits specify which row is the start of window. 3to0 - these bits specify which row is the end of window. data byte bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 msb column start address lsb wen ccs1 reserved bit name description 7to3 - these bits specify which column is the start of the window. 2 wen when this bit is set to logic 1 the corresponding window background is enabled. 1 ccs1 when this bit is set to logic 1, the characters resided within this particular window can have two extra colour selections (i.e. colour 2 and colour 3); see section display buffers. data byte bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 msb column end address lsb wr wg wb bit name description 7to3 - these bits specify which column is the end of the window. 2 to 0 wr, wg, wb these bits de?ne the colour of the window. data byte bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reserved msb vertical start position lsb
1997 mar 03 10 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 table 16 explanation of table 15 table 17 column 10 of row 10 table 18 explanation of table 17 a horizontal display line consists of 384 dots, which include 288 dots (e.g. 12 dots 24 characters) for display character, and 96 dots for the blank region. table 19 column 11 of row 10 table 20 explanation of table 19 bit name description 5to0 - these bits specify the vertical starting position of osd. the counting starts from the falling edge of the vflb signal (e.g. enter vertical ?yback period) and each increment represents four scan line movement to the bottom. 64 positions are provided. the default value is 4 after power-up. the time from the falling edge of the vflb signal to starting display is: t v = (vertical start position) 4 t h-sync +t h-sync . where t h-sync = one horizontal line display time. data byte bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reserved msb horizontal start position lsb bit name description 4to0 - these bits specify the horizontal starting position of osd. the counting starts from the falling edge of the hflb signal (e.g. enter horizontal flyback period) and each increment represents six dots movement to the right. 32 positions are provided. the default value is 15 after power-up. the time from the falling edge of the hflb signal to starting display is: t h = (horizontal start position) 6 t dot +61 t dot . where t dot = one pixel display time (e.g. one horizontal line display time/384). data byte bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 reserved ch5 ch4 ch3 ch2 ch1 ch0 bit name description 5 to 0 ch5 to ch0 these bits specify the height of displayed characters. table 21 shows the lines to be repeated. the height of character can be speci?ed from 16 to 63 scan lines. for example, when ch5 to ch0 = 00 0010, the height of character will be 18 scan lines, the 4th and 12th line will be double scanned but others will be scanned once.
1997 mar 03 11 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 table 21 the repeat line of character note 1. v indicates which line of the character will be repeated one more time. table 22 column 12 of row 10 table 23 explanation of table 22 ch5 to ch0 line number (1) 0123456789101112131415 ch0 = 1 -------- v ------- ch1 = 1 ---- v ------- v --- ch2 = 1 -- v --- v --- v --- v - ch4 = 1 - v - v - v - v - v - v - v - v ch5 and ch4 = 0x all sixteen lines scanned once ch5 and ch4 = 10 all sixteen lines scanned twice ch5 and ch4 = 11 all sixteen lines scanned three times data byte bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0 osden bsen shse reserved fbc bit name description 7 osden the osd circuit is active when this bit is set to logic 1. the outputs of r, g, b and fb will be high impedance when osd is disabled. 6 bsen the bordering or shadowing effect is enabled when this bit is set to logic 1. 5 shse the shadowing of characters is selected if this bit is set to logic 1, otherwise bordering of characters is chosen. 0 fbc this bit defines the output configuration of the fb pin. if this bit is set to logic 0, then the output of fb will be logic high when displaying character or window, otherwise the output of fb is logic high only when displaying characters.
1997 mar 03 12 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 character rom the character rom contains 128 character fonts. each font consists of a 12 16 dot matrix. bordering and shadowing of characters the characters displayed on the screen can be specified with or without shadowing or with border shadowing by setting the bsen and shse bits of frame control register column 11 of row 10. if shadowing is specified, there is black shadow on the right and bottom sides of character, and if border shadowing is specified, the black shadowing will surround both internal and external sides of characters (see fig.5). the characters shadow will not appear if it is outside the display area of character (i.e. 12 16 dots). combination of two or more character fonts to formulate a new symbol user can combine two (or more) character fonts to formulate a new higher resolution symbol in a horizontal direction, but the combination of two fonts in a vertical direction could cause the shadowing or bordering shadow of upper font to be missed if shadowing or bordering is applied. pll clock generator by tracing the signal on the hflb pin, the on-chip pll circuit generates the clock (vclk) which is used for both system clock and dot clock of the osd. the frequency of vclk signal is determined by following equation: f vclk =f hflb 384 (i.e. the frequency range of vclk signal is from 3.84 to 38.4 mhz). when there is no horizontal sync pulse present on the hflb pin, the pll circuit will generate a 2.5 mhz (approximate) clock for the system clock, and the red, green, blue and fb pins will be high impedance. fig.5 character shadowing and bordering. handbook, full pagewidth 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 no shadow 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 shadowing 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 mgd759 bordering shadow
1997 mar 03 13 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 PCB8517p/001 character fonts n dbook, full pagewidth mgd755 fig.6 character fonts 00h to 1fh.
1997 mar 03 14 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 fig.7 character fonts 20h to 3fh. n dbook, full pagewidth mgd756
1997 mar 03 15 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 n dbook, full pagewidth mgd757 fig.8 character fonts 40h to 5fh.
1997 mar 03 16 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 n dbook, full pagewidth mgd758 fig.9 character fonts 60h to 7fh.
1997 mar 03 17 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 limiting values in accordance with the absolute maximum rating system (iec 134). dc characteristics symbol parameter min. max. unit v ddx digital supply voltage - 0.3 +7.0 v v i input voltage (all inputs) - 0.3 v ddx + 0.3 v t stg storage temperature - 55 +125 c t amb operating ambient temperature 0 70 c symbol parameter conditions min. typ. max. unit supply v ddx digital supply voltage 4.75 5.0 5.25 v i ddx digital supply current v i =v ddx ; no load on outputs -- 25 ma inputs v ih high level input voltage 2.0 - v ddx + 0.3 v v il low level input voltage v ssx - 0.3 - 0.8 v outputs i oh(source) high level output current (source) v o 3 v ddx - 0.8 5.0 -- ma i ol(sink) low level output current (sink) v o 0.5 5.0 -- ma
1997 mar 03 18 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 application information fig.10 application circuit. the analog power and ground pins should be separated from other circuits. (1) only connected when half tone is applied. (2) the recommended circuit or value of components connected to vco and bias could be changed in a different printed-circuit board layout. handbook, full pagewidth red hflb vflb 15 5 horizontal sync from deflection circuit vertical sync from deflection circuit 10 en 6 sdi 7 sck mgd761 8 14 13 12 11 2 3 r, g and b video signals from pc or work station green blue fb htone 5.6 k w 5.6 k w 10 k w 0.01 m f 0.01 m f 1 m w vco (2) bias (2) (1) mixer microcontroller pcf8517 r, g and b outputs to video circuit
1997 mar 03 19 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 package outline references outline version european projection issue date iec jedec eiaj sot38-4 92-11-17 95-01-14 m h c (e ) 1 m e a l seating plane a 1 w m b 1 b 2 e d a 2 z 16 1 9 8 e pin 1 index b 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 0.76 4.2 0.51 3.2 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.01 0.10 0.30 0.32 0.31 0.39 0.33 0.030 0.17 0.020 0.13 dip16: plastic dual in-line package; 16 leads (300 mil) sot38-4
1997 mar 03 20 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 soldering introduction there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. however, wave soldering is not always suitable for surface mounted ics, or for printed-circuits with high population densities. in these situations reflow soldering is often used. this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ic package databook (order code 9398 652 90011). soldering by dipping or by wave the maximum permissible temperature of the solder is 260 c; solder at this temperature must not be in contact with the joint for more than 5 seconds. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg max ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. repairing soldered joints apply a low voltage soldering iron (less than 24 v) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. definitions life support applications these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips for any damages resulting from such improper use or sale. data sheet status objective speci?cation this data sheet contains target or goal speci?cations for product development. preliminary speci?cation this data sheet contains preliminary data; supplementary data may be published later. product speci?cation this data sheet contains ?nal product speci?cations. limiting values limiting values given are in accordance with the absolute maximum rating system (iec 134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the speci?cation is not implied. exposure to limiting values for extended periods may affect device reliability. application information where application information is given, it is advisory and does not form part of the speci?cation.
1997 mar 03 21 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 notes
1997 mar 03 22 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 notes
1997 mar 03 23 philips semiconductors objective speci?cation stand-alone osd for monitor applications PCB8517 notes
internet: http://www.semiconductors.philips.com philips semiconductors C a worldwide company ? philips electronics n.v. 1997 sca53 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. netherlands: postbus 90050, 5600 pb eindhoven, bldg. vb, tel. +31 40 27 82785, fax. +31 40 27 88399 new zealand: 2 wagener place, c.p.o. box 1041, auckland, tel. +64 9 849 4160, fax. +64 9 849 7811 norway: box 1, manglerud 0612, oslo, tel. +47 22 74 8000, fax. +47 22 74 8341 philippines: philips semiconductors philippines inc., 106 valero st. salcedo village, p.o. box 2108 mcc, makati, metro manila, tel. +63 2 816 6380, fax. +63 2 817 3474 poland: ul. lukiska 10, pl 04-123 warszawa, tel. +48 22 612 2831, fax. +48 22 612 2327 portugal: see spain romania: see italy russia: philips russia, ul. usatcheva 35a, 119048 moscow, tel. +7 095 755 6918, fax. +7 095 755 6919 singapore: lorong 1, toa payoh, singapore 1231, tel. +65 350 2538, fax. +65 251 6500 slovakia: see austria slovenia: see italy south africa: s.a. philips pty ltd., 195-215 main road martindale, 2092 johannesburg, p.o. box 7430 johannesburg 2000, tel. +27 11 470 5911, fax. +27 11 470 5494 south america: rua do rocio 220, 5th floor, suite 51, 04552-903 s?o paulo, s?o paulo - sp, brazil, tel. +55 11 821 2333, fax. +55 11 829 1849 spain: balmes 22, 08007 barcelona, tel. +34 3 301 6312, fax. +34 3 301 4107 sweden: kottbygatan 7, akalla, s-16485 stockholm, tel. +46 8 632 2000, fax. +46 8 632 2745 switzerland: allmendstrasse 140, ch-8027 zrich, tel. +41 1 488 2686, fax. +41 1 481 7730 taiwan: philips semiconductors, 6f, no. 96, chien kuo n. rd., sec. 1, taipei, taiwan tel. +886 2 2134 2870, fax. +886 2 2134 2874 thailand: philips electronics (thailand) ltd., 209/2 sanpavuth-bangna road prakanong, bangkok 10260, tel. +66 2 745 4090, fax. +66 2 398 0793 turkey: talatpasa cad. no. 5, 80640 gltepe/istanbul, tel. +90 212 279 2770, fax. +90 212 282 6707 ukraine : philips ukraine, 4 patrice lumumba str., building b, floor 7, 252042 kiev, tel. +380 44 264 2776, fax. +380 44 268 0461 united kingdom: philips semiconductors ltd., 276 bath road, hayes, middlesex ub3 5bx, tel. +44 181 730 5000, fax. +44 181 754 8421 united states: 811 east arques avenue, sunnyvale, ca 94088-3409, tel. +1 800 234 7381 uruguay: see south america vietnam: see singapore yugoslavia: philips, trg n. pasica 5/v, 11000 beograd, tel. +381 11 625 344, fax.+381 11 635 777 for all other countries apply to: philips semiconductors, marketing & sales communications, building be-p, p.o. box 218, 5600 md eindhoven, the netherlands, fax. +31 40 27 24825 argentina: see south america australia: 34 waterloo road, north ryde, nsw 2113, tel. +61 2 9805 4455, fax. +61 2 9805 4466 austria: computerstr. 6, a-1101 wien, p.o. box 213, tel. +43 1 60 101, fax. +43 1 60 101 1210 belarus: hotel minsk business center, bld. 3, r. 1211, volodarski str. 6, 220050 minsk, tel. +375 172 200 733, fax. +375 172 200 773 belgium: see the netherlands brazil: see south america bulgaria: philips bulgaria ltd., energoproject, 15th floor, 51 james bourchier blvd., 1407 sofia, tel. +359 2 689 211, fax. +359 2 689 102 canada: philips semiconductors/components, tel. +1 800 234 7381 china/hong kong: 501 hong kong industrial technology centre, 72 tat chee avenue, kowloon tong, hong kong, tel. +852 2319 7888, fax. +852 2319 7700 colombia: see south america czech republic: see austria denmark: prags boulevard 80, pb 1919, dk-2300 copenhagen s, tel. +45 32 88 2636, fax. +45 31 57 1949 finland: sinikalliontie 3, fin-02630 espoo, tel. +358 9 615800, fax. +358 9 61580/xxx france: 4 rue du port-aux-vins, bp317, 92156 suresnes cedex, tel. +33 1 40 99 6161, fax. +33 1 40 99 6427 germany: hammerbrookstra?e 69, d-20097 hamburg, tel. +49 40 23 53 60, fax. +49 40 23 536 300 greece: no. 15, 25th march street, gr 17778 tavros/athens, tel. +30 1 4894 339/239, fax. +30 1 4814 240 hungary: see austria india: philips india ltd, shivsagar estate, a block, dr. annie besant rd. worli, mumbai 400 018, tel. +91 22 4938 541, fax. +91 22 4938 722 indonesia: see singapore ireland: newstead, clonskeagh, dublin 14, tel. +353 1 7640 000, fax. +353 1 7640 200 israel: rapac electronics, 7 kehilat saloniki st, tel aviv 61180, tel. +972 3 645 0444, fax. +972 3 649 1007 italy: philips semiconductors, piazza iv novembre 3, 20124 milano, tel. +39 2 6752 2531, fax. +39 2 6752 2557 japan: philips bldg 13-37, kohnan 2-chome, minato-ku, tokyo 108, tel. +81 3 3740 5130, fax. +81 3 3740 5077 korea: philips house, 260-199 itaewon-dong, yongsan-ku, seoul, tel. +82 2 709 1412, fax. +82 2 709 1415 malaysia: no. 76 jalan universiti, 46200 petaling jaya, selangor, tel. +60 3 750 5214, fax. +60 3 757 4880 mexico: 5900 gateway east, suite 200, el paso, texas 79905, tel. +9-5 800 234 7381 middle east: see italy printed in the netherlands 547047/1200/01/pp24 date of release: 1997 mar 03 document order number: 9397 750 01017

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